Senior Server Liquid Cooling Thermal Design Engineer

About Asiacruit

At Asiacruit, we connect top talent with forward‑thinking organizations across industries. Our mission is to help businesses grow through smart, strategic, and people‑focused solutions. We are expanding our high‑performance computing and data center solutions practice and seek a Senior Server Liquid Cooling Thermal Design Engineer to join our engineering team supporting next‑generation server platforms and liquid‑cooled data center deployments.

Position Overview

We are seeking an experienced engineer with deep expertise in thermal systems, liquid cooling architectures, and server thermal/mechanical integration. The role requires hands‑on design, analysis, validation, and cross‑functional collaboration to deliver reliable, manufacturable thermal solutions for rack‑scale and hyperscale server products. You will drive thermal architecture decisions, lead thermal simulation and testing, and partner closely with electrical, mechanical, firmware, reliability, and manufacturing teams to ensure product performance, reliability, and serviceability.

Key Responsibilities

Cold Plates & Component Cooling

• Lead the end‑to‑end design of liquid‑cooling cold plates for GPUs, high‑power CPUs, and AI accelerator chips used in servers.
• Address chip‑level high heat flux density and transient power spikes through microchannel, jet impingement, and manifold flow topology optimization, heat‑spreading structure design, TIM selection, and lightweight structural design.
• Perform simulation and optimization to resolve non‑uniform flow distribution and localized overheating within cold plates.
  
  

• Lead thermal architecture and design for server and rack‑level liquid cooling solutions, including cold plates, manifolds/coolant distribution systems, heat exchangers, and coolant selection.
• Own the interface and compatibility between liquid‑cooling heat sinks and the overall server thermal system, ensuring performance compatibility with CDUs, piping, and quick‑connect fittings.
• Develop and validate thermal models for CPUs, GPUs, memory, power delivery, and other high‑power components; translate component heat maps into system‑level cooling strategies.
  
  

• Utilize CFD and thermal simulation tools—e.g., ANSYS Icepak, STAR‑CCM+, Siemens Simcenter—to conduct steady‑state and transient thermal analyses, including single‑phase and two‑phase coupled simulations.
• Apply FEA where appropriate for structural/thermal coupling and conduct parametric optimization.
  
  

• Define performance test plans for liquid‑cooling heat sinks (e.g., thermal resistance, pressure drop), design/build test rigs, and lead lab characterization (flow, leakage, vibration, reliability).
• Execute tests and analyze data to iterate designs; support mass‑production issue troubleshooting and solution development.
  
  

• Collaborate with mechanical design and manufacturing to meet structural, DFMA, serviceability, and cost targets.
• Work with electrical and firmware teams on thermal control strategies, sensors, and closed‑loop cooling algorithms; support software validation and tuning.
• Author and maintain technical documentation: thermal requirements, test procedures, DVPs, risk assessments, and change records.
  
  

• Drive DFx (test, assembly, service) and reliability‑by‑design practices; lead FMEA and implement mitigations.
• Partner with suppliers/CMs to qualify components (cold plates, seals, fittings, tubing, pumps), evaluate proposals, and support procurement decisions.
• Provide technical leadership and mentorship to junior engineers; contribute to project planning and design reviews.
  
  

• Education
• Master’s degree or above in Engineering Thermophysics, Thermal Engineering, Mechanical Engineering, Fluid Mechanics, or related disciplines. (Exceptional Bachelor’s candidates may be considered with strong, directly relevant experience.)
• Minimum 6 years in thermal design, including at least 2 years focused on liquid‑cooling heat sinks for servers (component and/or system level).
• Proven experience delivering production hardware through design, validation, and transfer‑to‑manufacturing.
• For module lead positions, team leadership and people management capabilities are required.
• Design Capability
• Proficient in 3D CAD tools such as SolidWorks, CREO, CATIA; able to independently complete complex cold‑plate structural design, engineering drawings, and tolerance analysis.
• Experience in liquid‑cooling hardware: cold plates, microchannels, manifolds, seal technologies, quick‑connect fittings, pumps, and system integration.
• Highly proficient in at least one mainstream CFD/thermal simulation tool (e.g., ANSYS Icepak, STAR‑CCM+, Siemens Simcenter); hands‑on with conjugate heat transfer, transient thermal analysis, and parametric optimization.
• Familiarity with FEA for structural/thermal coupling is a plus.
• Hands‑on with test equipment & DAQ: flow benches, pressure sensors, thermal chambers, IR thermography, instrumentation.
• Working knowledge of materials, corrosion/compatibility for coolants, and contamination control for liquid‑cooled electronics.
• Proficient producing/reviewing BOMs and manufacturing documentation.
• Familiarity with thermal control strategies and sensor integration; ability to collaborate with firmware/embedded teams.
• Analytical & Problem Solving: Strong physics‑based reasoning; ability to translate complex thermal interactions into actionable design changes.
• Hands‑on Validation: Designs experiments, operates lab equipment, and qualifies hardware to thermal/reliability targets.
• Cross‑functional Collaboration: Works effectively with EE, ME, FW, Reliability, Operations, and suppliers.
• Design for Manufacturing & Reliability: Applies DFMA/DFMEA; designs for serviceability and high‑volume production.
• Project Leadership: Leads technical workstreams, prioritizes, manages risks, and mentors junior engineers.
• Communication: Strong written/verbal communication; produces clear reports and presents findings to stakeholders.
• Experience with rack‑level liquid cooling, rear‑door heat exchangers, or immersion cooling.
• Prior work on hyperscale/enterprise servers, HPC, or telecom equipment.
• Familiarity with regulatory and safety standards for liquid‑cooled electronic equipment.
• Advanced degree in thermal/fluids or publications/patents in thermal management.
• Flexible and remote work options supporting work–life balance; onsite lab access for testing/validation as required.
• Collaborative, diverse team delivering cutting‑edge cooling solutions for global clients and cloud providers.
• Professional growth, ongoing training, and support for advanced degrees/certifications.
• Competitive compensation, benefits, and performance incentives aligned with industry standards.
• A culture that values engineering excellence, continuous improvement, and inclusive teamwork.