Sr Wire Bond NPI Engineer

Job Description

Job Summary:

onsemi is currently seeking an experienced Process Engineer to work on product qualification (NPI/NPD, fab transfer, In-sourcing, others as deemed necessary) and safe launch lots for ultrasonic wirebond and IVI processes for all the product groups. Lead investigation on issues / EFAR cases related to ultrasonic wire bonding process under NPI category and lead WB technology and material roadmap.

Competencies

• Leading WB Set-up fo New Product Introductions
• Knowledge on Orthodyne and KNS/Power fusion wirebond platforms with deep understanding on the parameters, materials and tools.
• Establishing process windows using DOE and pareto analysis
• Ability to improve Cpk/Cp and DPMO for WB parameters
• Root‑cause analysis of bond lifts, non‑sticks, wire breaks, cratering
• Correlation of WB defects to substrate, leadframe, die, and mold compound interactions.
• Driving safe‑launch strategies and containment plans
• Coordinating WB readiness during ramp‑up phases
  
  

Responsibilities

• Provide process support for ultrasonic wirebond process and IVI (as applicable) working closely with the technical leader.
• Generate qualification plan for NPI projects at wirebond based on risk analysis defining the critical input variable and output responses referencing the characterization spec.
• Generate qualification reports based on qualification plan per deliverables defined for the project.
• Create wirebond and/or IVI recipes in collaboration with sustaining PE and/or CE.
• Lead the investigation on issues related to wirebond for NPI projects in collaboration with the technical leader to identify rootcause and provide improvement plans.
• Handles documentation related to the process/es of assignment.
• Handles other responsibility as deemed necessary by the supervisor.
  
  

Qualifications

• Engineering graduate or Material Science or Physics Graduate or Equivalent.
• Experience in semiconductor assembly manufacturing for at least 5 years with specific experience in ultrasonic wire bonding process or related process.
• Skilled in data analysis using Minitab and other software that will aid process performance assessment.
• Knowledgeable on 8D, FMEA, Control Plan, DOE & Risk Management and Mitigation.
• Understand Orthodyne and KNS wirebond platforms.
• Team player and result driven.
• Critical thinker.
• Good presentation skills.
  
  

About Us

onsemi (Nasdaq: ON) is driving disruptive innovations to help build a better future. With a focus on automotive and industrial end-markets, the company is accelerating change in megatrends such as vehicle electrification and safety, sustainable energy grids, industrial automation, and 5G and cloud infrastructure. With a highly differentiated and innovative product portfolio, onsemi creates intelligent power and sensing technologies that solve the world’s most complex challenges and leads the way in creating a safer, cleaner, and smarter world.

More details about our company benefits can be found here:

https://www.onsemi.com/careers/career-benefits

About The Team

We are committed to sourcing, attracting, and hiring high-performance innovators, while providing all candidates a positive recruitment experience that builds our brand as a great place to work.

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