Talentmate
Philippines
22nd September 2026
2609-5709-1129
Job Description
Wire Bond Process Engineer optimizes, sustains, and develops ultrasonic wire bonding processes to enhance yield, quality, and cost-efficiency in semiconductor manufacturing. Key duties include managing New Product Introductions (NPI), conducting DoE (Design of Experiments) for process optimization, troubleshooting defects (bond lifts, wire breaks), and mentoring junior staff.
Responsibilities
| Role Level: | Not Applicable | Work Type: | Full-Time |
|---|---|---|---|
| Country: | Philippines | City: | Lapu-Lapu Central Visayas |
| Company Website: | http://www.onsemi.com | Job Function: | Engineering |
| Company Industry/ Sector: |
Semiconductor Manufacturing | ||
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