Job Description

Job Description

Basic Purpose of the Job

  • Lead and develop the FOL Process Engineering organization (Die Attach, Clip Attach, Wire Bond, Plasma and AOI).
  • Ensure stable yield, high equipment/process capability, adherence to customer and reliability requirements, and timely closure of quality/EFAR/GMRB issues.
  • Drive continuous improvement, standardization, process governance, and readiness for volume and package‑mix expansion.

Reporting Relationship

  • Reports to the Assembly Engineering Manager; leads a team of Process Engineers across Die Attach, Clip Attach, Wire Bond, Plasma and AOI.

Responsibilities

Major Duties and Responsibilities

  • Provide strategic process ownership for all FOL Package Group (SPC governance, PFMEA/Control Plan, recipe management, process capability Ppk, documentation).
  • Lead engineering responses to yield losses, top defect contributors, customer complaints, reliability audit failures, and GMRB cases.
  • Oversee execution of Continuous Improvement Plan, productivity projects, and proliferation activities across CBSM, SOSM, and PPD packages.
  • Ensure audit readiness (IATF/ISO/Customer), compliance to change control, and cross‑functional alignment with Production, Quality, Equipment, NPI, Planning, and SQE.
  • Develop technical talent, strengthen process ownership, and balance engineering workload.

Qualifications

  • Education
  • Bachelor’s degree in Engineering (Mechanical, Electronics, Chemical, or related field).
  • Experience
  • 8+ years in semiconductor assembly (Die Attach / Wire Bond), with proven leadership in high‑mix, high‑complexity FOL operations.
  • Demonstrated capability in yield improvement, DOE, SPC, PFMEA/Control Plan, and equipment/materials qualification.
  • Skills & Knowledge Requirements
  • Strong technical mastery in FOL processes (DA, WB, Clip Attach, Plasma) and failure mechanisms.
  • Excellent analytical skills (Minitab/Exensio/SPC), problem‑solving (8D, DMAIC), and audit/customer‑facing communication.
  • Ability to lead teams, manage cross‑functional escalations, and sustain process governance under high‑volume/high‑complexity environments

About Us

onsemi (Nasdaq: ON) is driving disruptive innovations to help build a better future. With a focus on automotive and industrial end-markets, the company is accelerating change in megatrends such as vehicle electrification and safety, sustainable energy grids, industrial automation, and 5G and cloud infrastructure. With a highly differentiated and innovative product portfolio, onsemi creates intelligent power and sensing technologies that solve the world’s most complex challenges and leads the way in creating a safer, cleaner, and smarter world.

More details about our company benefits can be found here:

https://www.onsemi.com/careers/career-benefits

About The Team

We are committed to sourcing, attracting, and hiring high-performance innovators, while providing all candidates a positive recruitment experience that builds our brand as a great place to work.


Job Details

Role Level: Not Applicable Work Type: Full-Time
Country: Philippines City: Lapu-Lapu Central Visayas
Company Website: http://www.onsemi.com Job Function: Engineering
Company Industry/
Sector:
Semiconductor Manufacturing

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