Operator Die Bond

Job Description

To contribute in advancing high‑precision semiconductor production by applying technical skills in back‑end assembly test operation.

Responsibilities

• Perform specific back-end semiconductor manufacturing functions in the production of semiconductor devices
• Operate various equipment in performing functions such as wafer scribe and break, die sort, die attach, lead bonding and seal, test, or mark and pack.
  
  

Qualifications

• Graduate of a 2-year Technical course or Senior High School, or completed at least 2 years in college
  
  

About Us

onsemi (Nasdaq: ON) is driving disruptive innovations to help build a better future. With a focus on automotive and industrial end-markets, the company is accelerating change in megatrends such as vehicle electrification and safety, sustainable energy grids, industrial automation, and 5G and cloud infrastructure. With a highly differentiated and innovative product portfolio, onsemi creates intelligent power and sensing technologies that solve the world’s most complex challenges and leads the way in creating a safer, cleaner, and smarter world.

More details about our company benefits can be found here:

https://www.onsemi.com/careers/career-benefits

About The Team

We are committed to sourcing, attracting, and hiring high-performance innovators, while providing all candidates a positive recruitment experience that builds our brand as a great place to work.

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