RandD Development Manager

Are you looking for a unique opportunity to be a part of something great? Want to join a 17,000-member team that works on the technology that powers the world around us? Looking for an atmosphere of trust, empowerment, respect, diversity, and communication? How about an opportunity to own a piece of a multi-billion dollar (with a B!) global organization? We offer all that and more at Microchip Technology Inc.

People come to work at Microchip because we help design the technology that runs the world. They stay because our culture supports their growth and stability. They are challenged and driven by an incredible array of products and solutions with unlimited career potential. Microchip’s nationally-recognized Leadership Passage Programs support career growth where we proudly enroll over a thousand people annually. We take pride in our commitment to employee development, values-based decision making, and strong sense of community, driven by our Vision, Mission, and 11 Guiding Values; we affectionately refer to it as the Aggregate System and it’s won us countless awards for diversity and workplace excellence.

Our company is built by dedicated team players who love to challenge the status quo; we did not achieve record revenue and over 30 years of quarterly profitability without a great team dedicated to empowering innovation. People like you.

Visit our careers page to see what exciting opportunities and company perks await!

Job Description

This position is for an R&D and NPI engineering manager to support Panel Level Package development in Microchip's Philippine factory

Requirements/Qualifications

Education

BS degree in Electrical, Material, Mechanical engineering or other equivalent engineering field

Work Experience

• At least 8 years of direct or managed IC packaging engineering experience including advanced pkg development (WLCSP, stacked die, laminate and lead frame packages)
• Prior exposure and work in a high-volume IC assembly production/factory is preferred
  
  

• CAD software use (e.g. AutoCAD and Cadence APD)
• FEA modeling experience for thermal, mechanical and electrical package optimization
• Advanced package development knowledge including WLCSP, Cu pillar bump, SiP packaging, and Cu Clip assembly
• Experience in strip-testable package development