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数字芯片实习生

Talentmate

Philippines

16th April 2026

2604-29518-2

Job Description

职位来源于实习僧。

岗位职责： 1、负责SOC/ASIC芯片模块的微架构设计、设计文档开发、RTL实现、系统集成、PPA分析与优化、质量活动等工作； 2、负责SOC/ASIC芯片模块的EDA验证、原型验证等工作； 3、负责SOC/ASIC芯片模块的综合、时序收敛、形式验证等工作； 4、开发自动化流程提高开发效率。任职要求：如果您熟悉VHDL/Verilog、SV等数字芯片设计及验证语言，或具备芯片/FPGA设计或者验证或者后端实现经验，均可投递。相关需求： 1、暑期短期实习，面向27年毕业生 2、长期实习需要6个月及以上，面向非27年毕业生

职位薪资：

300-500/天

想要了解更多，可以访问公司官网：career.huawei.com/reccampportal

Job Details

Role Level:	Internship	Work Type:	Internship
Country:	Philippines	City:	Haidian District Beijing China
Company Website:	http://www.huali.com	Job Function:	Training
Company Industry/ Sector:	IT Services and IT Consulting

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