Engineer I - Failure Analysis

Are you looking for a unique opportunity to be a part of something great? Want to join a 17,000-member team that works on the technology that powers the world around us? Looking for an atmosphere of trust, empowerment, respect, diversity, and communication? How about an opportunity to own a piece of a multi-billion dollar (with a B!) global organization? We offer all that and more at Microchip Technology Inc.

People come to work at Microchip because we help design the technology that runs the world. They stay because our culture supports their growth and stability. They are challenged and driven by an incredible array of products and solutions with unlimited career potential. Microchip’s nationally-recognized Leadership Passage Programs support career growth where we proudly enroll over a thousand people annually. We take pride in our commitment to employee development, values-based decision making, and strong sense of community, driven by our Vision, Mission, and 11 Guiding Values; we affectionately refer to it as the Aggregate System and it’s won us countless awards for diversity and workplace excellence.

Our company is built by dedicated team players who love to challenge the status quo; we did not achieve record revenue and over 30 years of quarterly profitability without a great team dedicated to empowering innovation. People like you.

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Job Description

The Failure Analysis (FA) Engineer performs detailed electrical and physical failure analysis for all MCHP products using non-destructive analytical tools, curve tracing, electrical ATE and bench characterization, defect/fault localization, sample preparation, destructive physical FA techniques, and material analysis. Responsible for providing FA reports, regular FA updates, and timeline to customers. Works with different cross-functional team such as FA counterparts, Customer Quality, Quality, Reliability, Apps, Design, Foundry, Test and Product Engineering, and Wafer fab as appropriate to resolve FA cases.

Requirements/Qualifications

Specific Duties & Responsibilities

• Performs detailed electrical and physical failure analysis for all MCHP products using non-destructive analytical tools (such as X-ray, Scanning Acoustic Microscope (SAM), and Optical microscopes), electrical bench verification tools and ATE datalog interpretations, circuit schematics interpretation, fault isolation techniques (such as Photo Emission Microscope (PEM), Thermal Emission/Hotspot Analysis, Optical Beam-Induced Resistance Change (OBIRCH), and die level microprobing), deliding/delayering techniques (such as chemical and laser decapsulation, chemical etch, dry etch, mechanical polishing, or combination of different etches), and SEM/EDX analysis.
• Works with fellow engineers both local and other Failure Analysis engineering counterparts from different Microchip sites to develop failure analysis techniques and capabilities if needed.
• Works with different cross-functional team such as FA counterparts, CQE, Quality, Reliability, Apps, Design, Foundry, Test and Product Engineering, Line Engineering and technicians, and Wafer fab as appropriate to resolve FA cases.
• Works with external or 3rd party FA laboratory to utilize advanced FA technique capabilities needed for analysis.
• Reviews assigned failure analysis case and request additional information if needed.
• Ensures that historical data are reviewed for any relevant information that can be used for the analysis.
• Performs and/or reviews initial analysis and define appropriate next analysis steps.
• Provides regular FA updates and timeline to customer.
• Ensures that FA reports are release on time based on target average cycle time.
• FA focal person responsible in advanced tools/equipment 5S and improvements and coordination with FAREL Equipment group for consumables & spare parts procurements, repair, and maintenance.
• Generates comprehensive failure Analysis Report based on analysis findings.
• Supports and implements Environmental Management Systems and Quality Management Systems standards
• Observe safety and housekeeping “Clean as you go” during day-to-day failure analysis activities.
• Develop and implement new failure analysis methods if necessary.
  
  

• Has minimum of 4 years relevant experience in a semiconductor or electronics manufacturing environment with work experience from Quality and Reliability, Failure Analysis, Product or Process Engineering.
• Knowledgeable in programming languages such as C language/C++, Assembly language, and Phyton.
  
  

• Good knowledge and experience in electronic /electrical circuit and material analysis.
• Able extract, analyze, and report data as necessary.
• Computer literate (MS Word, PowerPoint, and Excel).
• Able to communicate and coordinate throughout all levels and functions of the organization as a team player with little supervision.
• Good knowledge of tools and methods related to inspection and analysis of components of both package and die form in semiconductor industry environment.
• Good interpersonal and communication skills (verbal and written) with the capability to interface throughout all levels and functions.