Own backend external manufacturing NPI from conceptualization, development, qualification to production launch
Functional Leadership for NPI to deliver PLM requirements for new product commercialization and to co-work with cross functional team (comprising both internal and external stakeholders) to achieve on-time market release
Interface & steer cross-functional team engagements across Business Units, Central Engineering, Operations, Quality, Supply Chain and Procurement to meet department objectives
Drive DFM, technology & manufacturability readiness for new package & complex derivative platforms for effective POR freeze to new product industrialization
Partner with OSATs to deliver assembly readiness for new product qualification. Key activities include process flow & BOM setup, risk analysis & mitigation, process characterization, lookahead assessment, qualification and CAB preparation leading to first part release
Manage production ramp: lead production safe launch, provide technical support to resolve ramp issues, develop CIP, set production baseline for transition into HVM
Collaborate with internal & external partners for technology pathfinding, package roadmap as well as design rules/ guideline development
Adoption of data analytics and data-driven approach to problem solving and decision making
Establish Best Known Methods (BKM) and Best-in-Class practices for new package platform and fan-out to production
Participate in quality and process readiness audit to achieve production site readiness
Co-work with operations to drive continuous yield improvement for evolving challenges
Subject Matter Expert to address arising package and assembly challenges
Experienced candidate(s) will be considered for technical lead role to manage team (5-6 person) team’s performance including overall delivery, tactical, resource planning & execution
Qualifications
Bachelor's Degree in Engineering/ Materials Science or equivalent technical background
More than 10 years of experience in backend semiconductor IC manufacturing environment, with in-depth assembly process expertise and shop floor experience
Strong leadership with demonstrated project management skills across multi-stakeholder and cross-functional settings
Hands-on assembly process experience in leading wafer technology such as SiC, GaN and CIS Imaging is highly desirable
Prior experience in NPI, product/ process integration and familiar with Chip-to-Package Interaction (CPI) effect
Experience in IC package design/ CAD/ simulation/ characterization will be advantageous
Good overall understanding of OSAT business landscape and operations
Adept at cross-functional collaboration, Adaptable to matrix organization, strong engineering fundamentals (including DOE characterization, SPC, failure analysis) and problem-solving skills
Strong project management skills and multi-stakeholder management
Proficient in statistical analysis methods and familiar with data analytics
Good communication skills and proficient in written & spoken English. Spoken proficiency in Mandarin will be advantageous
About Us
onsemi (Nasdaq: ON) is driving disruptive innovations to help build a better future. With a focus on automotive and industrial end-markets, the company is accelerating change in megatrends such as vehicle electrification and safety, sustainable energy grids, industrial automation, and 5G and cloud infrastructure. With a highly differentiated and innovative product portfolio, onsemi creates intelligent power and sensing technologies that solve the world’s most complex challenges and leads the way in creating a safer, cleaner, and smarter world.
More details about our company benefits can be found here:
https://www.onsemi.com/careers/career-benefits
About The Team
We are committed to sourcing, attracting, and hiring high-performance innovators, while providing all candidates a positive recruitment experience that builds our brand as a great place to work.
Searching, interviewing and hiring are all part of the professional life. The TALENTMATE Portal idea is to fill and help professionals doing one of them by bringing together the requisites under One Roof. Whether you're hunting for your Next Job Opportunity or Looking for Potential Employers, we're here to lend you a Helping Hand.
Disclaimer: talentmate.com is only a platform to bring jobseekers & employers together.
Applicants
are
advised to research the bonafides of the prospective employer independently. We do NOT
endorse any
requests for money payments and strictly advice against sharing personal or bank related
information. We
also recommend you visit Security Advice for more information. If you suspect any fraud
or
malpractice,
email us at abuse@talentmate.com.
You have successfully saved for this job. Please check
saved
jobs
list
Applied
You have successfully applied for this job. Please check
applied
jobs list
Do you want to share the
link?
Please click any of the below options to share the job
details.
Report this job
Success
Successfully updated
Success
Successfully updated
Thank you
Reported Successfully.
Copied
This job link has been copied to clipboard!
Apply Job
Your application for External Manufacturing NPI Engineer
has been successfully submitted!
To increase your chances of getting shortlisted, we recommend completing your profile.
Employers prioritize candidates with full profiles, and a completed profile could set you apart in the
selection process.
Why complete your profile?
Higher Visibility: Complete profiles are more likely to be viewed by employers.
Better Match: Showcase your skills and experience to improve your fit.
Stand Out: Highlight your full potential to make a stronger impression.
Complete your profile now to give your application the best chance!