NPI Integration Lead

Role Overview

An NPI Manager in an OSAT (Outsourced Semiconductor Assembly & Test) factory is responsible for managing the introduction of new semiconductor products from development to high-volume manufacturing. This role ensures smooth product qualification, engineering readiness, and production ramp-up while coordinating across cross-functional teams, including customers, engineering, operations, and supply chain.

Responsibilities

• NPI Project Management & Execution
  
  

•    Lead end-to-end NPI programs, from customer engagement to mass production ramp.
  
  

•    Define NPI project milestones, timelines, and deliverables in alignment with customer expectations.
  
  

•    Ensure DFM (Design for Manufacturability) and DFx (Design for Excellence) principles are applied early in the development phase.
  
  

•    Manage multiple concurrent product qualifications and engineering builds (EVT, DVT, PVT) across OSAT sites.
• Cross-Functional Coordination
  
  

•    Serve as the primary interface between customers and OSAT manufacturing teams for NPI activities.
  
  

•    Work closely with R&D, process engineering, quality, planning, and procurement teams to resolve technical and operational challenges.
  
  

•    Align with test engineering and assembly engineering teams to optimize test flow, package assembly processes, and yield improvement strategies.
  
  

•    Ensure smooth handover from NPI to volume production with stable yields and optimized cost.
• Product & Process Qualification
  
  

•    Drive product and package qualification (JEDEC, AEC-Q100 for automotive, etc.) in collaboration with quality and reliability teams.
  
  

•    Review FA (Failure Analysis), DOE (Design of Experiments), and yield analysis results to optimize process windows.
  
  

•    Ensure compliance with customer and industry standards (e.g., IPC, ISO9001, IATF 16949 for automotive applications).
• Manufacturing Readiness & Yield Optimization
  
  

•    Oversee the first article builds, engineering samples, and production ramp readiness.
  
  

•    Work with industrial engineering and operations to ensure factory capacity, tool readiness, and process stability.
  
  

•    Identify and mitigate risks related to yield excursions, process variation, and supply chain disruptions.
• Cost & Efficiency Improvement
  
  

•    Drive cost-effective NPI execution, ensuring BOM (Bill of Materials), cycle time, and process costs are optimized before volume production.
  
  

•    Identify opportunities for cycle time reduction, material cost savings, and process automation.
  
  

•    Ensure smooth transition from NPI to high-volume manufacturing with minimal yield loss and rework.
  
  

•    Minimum of Bachelor’s or Master’s degree in Engineering (Electronics, Mechanical, Industrial, or Manufacturing) or a related technical field.
  
  

•    Minimum of 10+ years of experience in semiconductor packaging, assembly, or test, with at least 3 years in an NPI leadership role.
  
  

•    Experience in OSAT, IDM, or semiconductor supply chain environments.
  
  

•    Strong understanding of advanced packaging technologies (FCBGA, WLCSP, SiP, 2.5D/3D ICs, automotive, or high-reliability applications).
  
  

•    Project Management: Expertise in Agile, PMP, or Six Sigma methodologies for NPI execution.
  
  

• Experience with flip-chip, wire bonding, die attach, molding, and test process flows.
• Knowledge of DFM, SPC (Statistical Process Control), DOE (Design of Experiments), and FA (Failure Analysis).
•  Reliability & Qualification Standards: Familiarity with JEDEC, AEC-Q100, MIL-STD, and IPC requirements.
•  Data Analytics & Yield Analysis: Proficiency in JMP, Minitab, Python, SQL, or other statistical tools.
•  Strong leadership and communication skills to manage cross-functional teams and customer interactions.
•  Problem-solving mindset with the ability to manage multiple projects under tight deadlines.
• Customer-focused approach to ensure seamless collaboration between OSAT and semiconductor clients.
• Experience in high-reliability or automotive semiconductor manufacturing (SEMI standards, IATF 16949, ISO 26262, ASPICE).
• Working knowledge of SAP, MES, and smart factory tools for NPI tracking and production scaling.
• Experience in both PCBA/SMT and IC packaging preferred
• Knowledge in IATF and APQP process
• Exposure to AS9100 with electronics manufacturing preferred