IC Technology Development - Mold Process Engineer

About The Business

Tata Electronics Private Limited (TEPL) is a greenfield venture of the Tata Group with expertise in manufacturing precision components.

Tata Electronics (a wholly owned subsidiary of Tata Sons Pvt. Ltd.) is building India’s first AI-enabled state-of-the-art Semiconductor Foundry. This facility will produce chips for applications such as power management IC, display drivers, microcontrollers (MCU) and high-performance computing logic, addressing the growing demand in markets such as automotive, computing and data storage, wireless communications and artificial intelligence.

Tata Electronics is a subsidiary of the Tata group. The Tata Group operates in more than 100 countries across six continents, with the mission 'To improve the quality of life of the communities we serve globally, through long term stakeholder value creation based on leadership with Trust.’

About The Role

Introduce and maintain EOL (Moulding, Laser marking, Singulation and Wire bond) Assembly processes and activities to ensure the requested requirements from manufacturing and quality are achieved.

Key Responsibilities

• Handson experience in FOL or EOL process within semiconductor industry, with a proven track record of accomplishment.
• In-depth knowledge of any single /multiple process related to process and equipment.
• Set up and operate FOL or EOL equipment according to established procedures.
• Lead and manage the wire bond team, providing guidance, coaching, and support.
• Foster a collaborative and high-performance work environment within the department.
• Conduct inspections of wire bonds to ensure they meet quality standards and specifications.
• Troubleshoot and resolve issues related to process or equipment, collaborating with CFT teams when necessary to enhance efficiency, quality and yield.
• Maintain accurate records of production activities, including process parameters, equipment settings, and quality control data.
• Contribute to the creation and updating of standard operating procedures (SOPs) related to wire bonding processes.
• Collaborate with program manager and deliver reports on time.
• Establish and enforce quality control measures for wire bonding operations.
• Ensure compliance with industry standards and customer specifications.
• Develop and implement strategic plans for the wire bonding department in alignment with overall organizational goals.
• Identify opportunities for cost savings, productivity enhancements, and technological advancements.
• Collaborate with other department heads, including engineering, production, and quality assurance, to achieve seamless integration of processes.
• Communicate effectively with stakeholders to address challenges and optimize workflows.
• Identify and address skill gaps within the team.
• Ensure accurate documentation of wire bonding processes, equipment settings, and quality control data.
• Communicate effectively with team members to address issues and drive continuous improvement.
• Generate reports on departmental performance and key metrics.
  
  

• Strong analytical and problem-solving skills
• Excellent communication and interpersonal skills.
• Demonstrated ability to lead and motivate a diverse team.
  
  

• Bachelor’s degree in mechanical, Electronics or Electrical Engineering.