IC Technology Development BOM And Costing Manager

About The Business

Tata Electronics Private Limited (TEPL) is a greenfield venture of the Tata Group with expertise in manufacturing precision components.

Tata Electronics (a wholly owned subsidiary of Tata Sons Pvt. Ltd.) is building India’s first AI-enabled state-of-the-art Semiconductor Foundry. This facility will produce chips for applications such as power management IC, display drivers, microcontrollers (MCU) and high-performance computing logic, addressing the growing demand in markets such as automotive, computing and data storage, wireless communications and artificial intelligence.

Tata Electronics is a subsidiary of the Tata group. The Tata Group operates in more than 100 countries across six continents, with the mission To improve the quality of life of the communities we serve globally, through long term stakeholder value creation based on leadership with Trust.’

Responsibilities

• Collect requirements from sales and FAE.
• Perform BOM costing for RFQ to customer.
• Work with SME to collect CAPEX and tooling requirements.
• Collect UPH estimation for costing purpose from SMEs.
• Develop database for BOM costing referencing to speed up cycle time.
• Able to communicate with both internal and external stakeholders.
• Update BOM and co-ordinate with team to implement in SAP system.
  
  

• Knowledge in wire bond diagram /netlist.
• Working knowledge in logical net-listings, schematics usage, electrical and routing rules creation.
• Good understanding & knowledge on Advanced Packaging architecture and semiconductor packaging process flow (Back Grinding, Dicing, Die Attach, Wire Bonding, Molding, P&P, Ball Attach, Trim & Form, Singulation).
• Strong presentation skills with excellent networking skills.
• Excellent English communication to work with a diverse cross-functional culture.
• Willing to tackle tough problems and enjoy problem solving. Comfortable in large corporate environments and can work with multi-functional teams across geographies.
  
  

• Bachelor Diploma / degree in Mechanical or Materials Science or electronics Engineering.
  
  

• Minimum 3+ years of experience in semiconductor packaging & substrate designing.