Process Engineering

Role Overview: 

SME -  Solder Paste Printer & Reflow  Soldering is responsible for overseeing, optimizing & continuously improving  processes to ensure on-time manufacturing with high quality of all ISP Products. 

The role is accountable for process yield, reliability, cost saving while building strong cross functional alignment with NPI & TD, equipment, quality and customer teams. 

Responsibilities: 

1. Technology & Process Setup 

• Manage & Optimization of SMT Production Processes of Solder Paste Printing , Inspection & Reflow. 

• Define and maintain all process windows, control plans & CTQ across all products of SPP , SPI & Reflow. 

• Setup, Operate, Programming, Optimizing SPP & Reflow Soldering machines. 

• Setup & Validation of Stencils, Squeegees, Solder Paste types & Printing parameters. 

• Develop & validate thermal profiles for new & existing PCB assemblies. 

• Stencil Design & Validation. 

• Conduct DOE & Process validation for new products and materials. 

• Setup , Monitor & Control critical reflow parameters 

(Zone temp., Conveyor Speed, Soak time, Peak temp.) 

2. New Model Readiness 

• Develop & Maintain Process documentation, WIs & SOPs (SPP, SPI & Reflow) 

• All new models trail pre-readiness (EVT/ DVT / PVT) , new model trail activities including trial builds & process validation. 

• Partner with NPI, TDG to ensure DFMEA and PFMEA of SPP,SPI & Reflow (related to soldering & thermal constraints ) 

• Ensure proper solder paste reflow per component and PCB design requirements 

• Ensure smooth technology transfer from development to production. 

• Own ramp-up metrics: yield learning curve, cycle time, scrap reduction. 

3. Quality Excellence 

• Accountable for first pass yield, final yield and field reliability. 

• Lead root cause analysis for yield excursions using SPI data , SPC charts , Yield Trends ,FMEA, DOE and failure analysis. 

• Monitor production yield , defect rates , cycle time and implement corrective / preventive actions. 

• Collaborate with Quality , NPI & Customer to resolve manufacturing & Quality issues such as tombstoning , voiding , bridging , cold joints and solder balls 

• Partner with Quality team to address customer returns, audits and escalations. 

• Monitor Process parameters ( temp. Zones , conveyor speedsoak time etc ) 

• Analyze & control print defects ( Insufficient / excess paste , smearing , bridging , skips , misalignment) 

• Analyze soldering defects ( tombstoning , voids , cold joints , bridging etc ) and implement corrective actions 

4.  Operational Excellence & Cost Optimization 

• Own cost of ownership and productivity improvement initiatives. 

• Drive Cycle time and line balancing improvements. 

• Lead process development , validation & continuous improvement initiatives ( Kaizen , Poka yoke , Lean Manufacturing ) 

• To ensure Proper line setup , programming , Program version management ( SPP , SPI & Reflow ) 

• To ensure compliance with ESD , Safety& IPC standards. 

• Analyze process data , SPC reports to identify trends & improvement opportunities. 

5. Customer & Stakeholder Engagement 

• Serve as a technical team member for customers on PCBA Soldering process topics. 

• Will be technical team member for customer reviews, technology discussions and risk mitigation plans. 

Key Deliverables & KPI 

• First Pass Yield 

• Yield and Reliability Performance 

• Productivity Improvement 

• Cost Optimization 

• Customer satisfaction and audit outcomes. 

Education Qualifications 

• Bachelor in related Engineering Discipline (Preferred Electronics Engineering)  

• 10-12 years’ hands on experience in SMT industry in a similar role ( Paste Printing , Inspection & lead free soldering processes ) 

• Experience in high volume manufacturing environment. 

• Hands on knowledge of SPP machines ( MPM Momentum / ASM Dek / Ekra / GKG / Fuji / Panasonic ) 

• Hands on experience with SMT reflow ovens with vacuum / without vacuum ( Heller / Ersa Rehm / Vitronics Soltec etc ) 

• Familiar with thermal profilers ( KIC , Datapaq , ECD etc ) 

• Deep Understanding of solder paste behaviour & thermal profiling 

• Proficiency in root cause analysis & problem solving tools ( 8D , 5 why , DOE ) 

• Strong knowledge on Stencil designing  (Thickness , aperture , step up / down stencils ) 

• Familiar with Lean manufacturing