Process Engineer - Plating

• Have strong background knowledge in EOL process and equipment for mold, plating,laser mark, trim and form. 

• Can support and train problem solving methodologies: 

• 7 QC tools,  

• Basic SPC include SPC training, 

• Yield analysis with analytics 

• Sampling plan 

• 8D 

• DMAIC Overview 

• Process mapping 

• Implementing Poka Yoke/ Lean Manufacturing 

• Design of Experiment (DOE) 

• FMEA  

• Knowledgeable in SPC tools (Minitab or JMP) is an advantage 

• Develop and implement production processes and can ensure to meet high quality standards 

• Develop and maintain accurate documentation of process changes, updates, and compliance with quality standards

Essential Attributes:

• Can work closely and effectively with cross-functional team (Production, Quality, NPI) to develop and implement SOPs.

Qualification:

• Educational Background: A Bachelor’s degree in Electronics/ Electrical Engineering, Mechanical Engineering, or a related field is typically required.

Desired Exprience Level:

• With minimum 8 years’ experience in assembly engineering on semiconductors industry