Lead SoC Physical Design Engineer Implementation And Signoff

WHAT YOU DO AT AMD CHANGES EVERYTHING

At AMD, our mission is to build great products that accelerate next-generation computing experiences—from AI and data centers, to PCs, gaming and embedded systems. Grounded in a culture of innovation and collaboration, we believe real progress comes from bold ideas, human ingenuity and a shared passion to create something extraordinary. When you join AMD, you’ll discover the real differentiator is our culture. We push the limits of innovation to solve the world’s most important challenges—striving for execution excellence, while being direct, humble, collaborative, and inclusive of diverse perspectives. Join us as we shape the future of AI and beyond. Together, we advance your career.

The Role

The position will involve working with a very experienced physical design team of Server SOC and is responsible for delivering the physical design of tiles and FullChip to meet challenging goals for frequency, power and other design requirements for AMD next generation processors in a fast-paced environment on cutting edge technology.

 

THE PERSON: 

The ideal candidate has significant experience in industry, with good attitude who seeks new challenges and has good analytical and problem-solving skills. You have excellent communication and presentation skills, demonstrated through technical publications, presentations, trainings, executive briefings, etc. You are meticulous about Power, Performance and Area while driving schedule and managing cost. You are highly adept at collaboration among top-thinkers and engineers alike, ready to mentor and guide, and help to elevate the knowledge and skills of the team around you.

KEY RESPONSIBILITIES: 

• RTL to GDS2 flow
• Handling Floor-plan, Physical Implementation of Power-plan, Synthesis, Placement, CTS, , Routing, Extraction, Timing Closure (Tile level, Full chip), Physical Verification (DRC & LVS), Crosstalk Analysis, EM/IR
• Handling different PNR tools - Synopsys FusionCompiler, Cadence Innovus, PrimeTime, StarRC, Mentor Graphics Calibre, Apache Redhawk
• Identify and implement opportunities for improving PPA
  
  
  

• 12+ years of professional experience in physical design, preferably with high performance designs.
• Experience in automated synthesis and timing driven place and route of RTL blocks for high speed datapath and control logic applications.
• Experience in automated design flows for clock tree synthesis, clock and power gating techniques, scan stitching, design optimization for improved timing/power/area, and design cycle time reduction.
• Experience in floorplanning, establishing design methodology, IP integration, checks for logic equivalence, physical/timing/electrical quality, and final signoff for large IP delivery
• Strong experience with tools for logic synthesis, place and route, timing analysis, and design checks for physical and electrical quality, familiarity with tools for schematics, layout, and circuit/logic simulation
• Experience in STA, full chip timing
• Versatility with scripts to automate design flow. Proficiency in scripting language, such as, Perl and Tcl.
• Strong communication skills, ability to multi-task across projects, and work with geographically spread out teams
• Experience in FinFET & Dual Patterning nodes such as 16/14/10/7/5nm/3nm
• Excellent physical design and timing background.
• Good understanding of computer organization/architecture is preferred.
• Strong analytical/problem solving skills and pronounced attention to details.
  
  
  

• Qualification: Bachelors or Masters in Electronics/Electrical Engineering