Job Description

Responsibilities

  • Development of semiconductor / Optoelectronics assembly & Packaging like LEDs, Hybrid Micro circuits, Chip on boards, optoelectronics packages
  • Process development of die attach , wire bonding , encapsulation etc , on various substrates using eutectic , solder , conductive / non conductive epoxies etc and transition to manufacturing scale ;
  • To take lead in Technology /Product transfer from sister companies, NPI Engineering , BOM creation and Maintenance, proto typing & FA Approvals
  • To workout manufacturing cost estimates , equipment capacity requirements , production ramp up requirements
  • Sustaining process engineering support , training Manufacturing personnel on developed process , SPC and yield analysis.
  • Investigate Customer Complaints / corrective action requests , Faiure and route cause analysis and initiate corrective and preventive action measures working with other functional groups

Qualifications

  • 10+ years hands on experience in a reputed Semiconductor / Optoelectronics manufacturing plant in assembly and packaging process development of die attach , wire bond and encapsulation .
  • Programming skills with automatic epoxy machines, Optical measurement systems desirable.
  • Working knowledge of FMEA , Six Sigma and statistical analysis using Minitab etc;
  • To interpretate mechanical drawings . Experience preferred to generate drawings in Solid works , Autocad drawings , Programming vision based measurement systems and process equipment.


Job Details

Role Level: Not Applicable Work Type: Full-Time
Country: India City: Greater Hyderabad Area
Company Website: http://www.osioptoelectronics.com/home.aspx Job Function: Engineering
Company Industry/
Sector:
Semiconductors

What We Offer


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