Thermal Simulation Engineering

Job Requirements

CFD / Thermal Simulation Engineer – Electronics Cooling

Position Overview

We are seeking a highly skilled CFD / Thermal Simulation Engineer with strong expertise in OpenFOAM and electronics thermal management. The successful candidate will be responsible for performing high‑fidelity thermal and fluid flow simulations, supporting electronics thermal design decisions, and translating complex simulation results into actionable engineering recommendations.

Key Responsibilities

• Lead CFD and thermal simulations using OpenFOAM, including solver selection, case setup, validation, debugging, and performance optimization.
• Develop and analyze models for heat transfer and fluid flow, applying strong theoretical fundamentals to practical engineering problems.
• Perform electronics cooling simulations at both component and system levels, including:
• PCBs and component-level heat sources
• Heat sinks and thermal interface materials
• Fan- and blower-driven airflow within enclosures
• Collaborate with cross-functional teams (hardware design, mechanical design, systems engineering) to support thermal design decisions.
• Analyze simulation results and present findings in a clear, concise, and actionable manner to technical and non-technical stakeholders.
• Create and maintain meshes, post-processing workflows, and validation procedures to ensure model accuracy.
• Develop automation scripts and tools using Python and/or C++ to improve simulation efficiency and repeatability.
• Support model verification, convergence studies, and comparison with experimental or test data where available.
• Document simulation methodologies, assumptions, and results according to engineering best practices.
  

• Proven expertise in OpenFOAM (Must-Have), including solver selection, setup, customization, and troubleshooting.
• Strong theoretical foundation in heat transfer and fluid dynamics.
• Hands-on experience with meshing and post-processing of CFD/thermal simulation results.
• Proficiency in Python and/or C++ for workflow automation and data processing.
• Excellent analytical and problem-solving skills.
  
  

• Experience in Electronics Thermal Design, including PCB-level and system-level modeling.
• Familiarity with electronics cooling components such as heat sinks, fans, and enclosures.
• Master’s degree (preferred) or higher in Mechanical Engineering, Aerospace Engineering, Thermal Engineering, or a related field.
• Experience translating simulation results into design recommendations that influence product decisions.
  
  

• Strong written and verbal communication skills.
• Ability to clearly explain complex simulation data to diverse stakeholders.
• Comfortable working in multi-disciplinary engineering teams.
  
  

• High-performance computing (HPC) or parallel simulation experience.
• Optimization or parametric studies for thermal design improvement.
• Exposure to electronics thermal standards or best practices.