Power Integrity Engineer

About Lumilens

At Lumilens we are building the critical photonics infrastructure that powers tomorrow’s AI supercomputing. From chip-to-chip optical interconnects to scalable photonic engines, Lumilens is unlocking a new era of computing faster, cooler, and massively more efficient.

We’re a well-funded startup backed by Mayfield and led by veterans who’ve builtAnd scaled some of the most transformative technologies in the industry. This isn’t incremental innovation, it’s a ground-floor opportunity to rethink the optical layer from the silicon up. You’ll work alongside a team of world-class engineers solving some of the hardest challenges in optics, systems, and scale. Every line of code, every design decision, every breakthrough you help deliver will shape the infrastructure of tomorrow.

If you're looking for mission, momentum, and the chance to make an outsized impact jump on the rocket ship. We’re just getting started.

Role Overview

We are seeking a skilled Power Integrity (PI) Engineer to optimize power distribution networks for OSFP transceiver designs. You will collaborate with cross-functional teams to ensure robust, low-noise power delivery for high-speed silicon photonics, DSPs, and retimers, minimizing PDN impedance and electromagnetic interference in dense 800G+ modules.

Key Responsibilities:

⁠Perform PI simulations using tools like Ansys SIwave, Keysight ADS, or Cadence Sigrity to model and optimize PDN for OSFP modules, targeting <1mΩ target impedance across 10kHz-100MHz bandwidth.

• ⁠Bachelor’s or Master’s in Electrical/Electronics Engineering, with focus on RF/mixed-signal design.
• 5+ years in PI for high-speed transceivers (OSFP, QSFP-DD, or CDFP preferred); hands-on with 50G+ SerDes.
• ⁠Proficiency in PI tools (Ansys, HyperLynx, Sigrity) and scripting (Python/MATLAB) for automation.
• ⁠Strong understanding of power converter topologies (Buck/Buck-Boost), ESL modeling, and EMI/EMC mitigation.
• ⁠Experience with OSFP mechanical constraints, flex-rigid PCBs, and multi-die integration (e.g., co-packaged optics).
• Preferred Skills
• Familiarity with thermal co-simulation (e.g., Ansys Icepak integration) for heat-affected PDN performance.
• Knowledge of advanced materials like low-Dk dielectrics or embedded passives for PDN miniaturization.
• Prior work on 1.6T OSFP or CPO (Co-Packaged Optics) prototypes.
  
  

• Competitive salary commensurate with experience
• Comprehensive benefits package including health insurance
• Professional development opportunities and certification support
• Access to cutting-edge technology and cloud platforms
• Collaborative work environment with cross-functional teams
• Lumilens is an equal opportunity employer. All qualified applicants will receive consideration without regard to race, color, religion, gender, identity, orientation, veteran status, disability, or any other legally protected status.